Technical terms used in board-level electronics repair — voltage rails, ICs, diagnostic techniques, protocols and Apple-specific concepts. New entries are added regularly.

Voltage Rails

TermDefinition
PP1V8_S31.8 V rail enabled in S3 suspend state
PP3V3_G3H3.3 V always-on rail derived from PPBUS_G3H
PP3V3_S33.3 V rail enabled in S3 suspend state
PP3V3_S53.3 V rail present in soft-off (S5) state
PP3V42_G3H3.42 V always-on rail that powers the SMC chip
PP5V_S55 V rail present in soft-off (S5) state
PPBUS_G3HApple's main always-on power bus, typically 12.5–12.6 V
PPBUS_S5_HSPPBUS high-side after the main power switch
PPVCORE_S0CPU core voltage, present only in S0 active state
PPVRTC_G3H3.0–3.3 V RTC keep-alive rail for the SMC/RTC

Power States

TermDefinition
G3 (Mechanical Off)Complete power-off: no voltage rails active
S0 (Active)Fully active state: all rails up, CPU running
S0ixModern low-power idle state used by Apple Silicon
S3 (Sleep)Sleep/suspend: RAM powered, CPU halted
S4 (Hibernate)Hibernate: RAM contents saved to disk, minimal power
S5 (Soft Off)Soft-off: only always-on rails active, awaiting power button

ICs ICs & Chips

TermDefinition
CD3215 / CD3217USB-C power delivery controller by Texas Instruments
INA3221Triple-channel current/voltage monitor used by Apple's SMC
ISL6259Charger IC used on Intel MacBooks, manages battery charging
ISL6264CPU core VRM controller on Intel MacBook Pro
ISL9239Multi-phase charger IC on later Intel and early Apple Silicon MacBooks
LP8550 / LP8558Backlight driver IC controlling display brightness
NCP81239Multi-phase GPU power controller used on NVIDIA/AMD GPUs
SMCSystem Management Controller — Apple's embedded power/thermal manager
T2 ChipApple's security and system management chip on 2017–2020 Intel Macs
T6002 / T6022Apple BMIC (Battery Management IC) on Apple Silicon MacBooks
TPS51125Dual-phase synchronous buck converter for DDR/CPU rails

Techniques Techniques

TermDefinition
Cold Solder JointBrittle solder connection with high resistance, often from thermal cycling
DC InjectionApplying low-voltage DC to locate short circuits by heat
Diode ModeMultimeter measurement mode used to check semiconductor junctions
Pad LiftingPCB trace pad detaching from the board during desoldering
ReballingRemoving and re-applying BGA solder balls to an IC
ReflowingRe-melting existing solder joints to restore cold solder connections
Resistance to GNDMeasurement comparing a rail or pin resistance to the ground plane
Ultrasonic CleaningUsing ultrasonic vibration in IPA to remove corrosion and flux residue
UnderfillEpoxy applied under BGA chips to reinforce mechanical bonding

Protocols Protocols

TermDefinition
I2CTwo-wire serial bus (SDA + SCL) used for inter-IC communication
JTAGBoundary-scan debug interface used for chip-level debugging
One-WireApple's proprietary single-wire protocol for MagSafe/charger identification
SMBusSystem Management Bus — I2C derivative used for battery and power comms
SPISerial Peripheral Interface — fast 4-wire bus for flash chips and sensors
USB Power DeliveryUSB-PD protocol for negotiating charging voltage and current over USB-C

Board Concepts

TermDefinition
ACOKAC OK signal — tells the SMC that a valid charger is connected
BGABall Grid Array — IC package where connections are solder balls on the underside
BoardviewSoftware file format (.brd/.bvr) showing PCB component placement
Decoupling CapacitorCapacitor placed near an IC to filter supply noise and transients
Ground PlaneCopper layer connected to GND, providing reference and shielding
LDOLow-Dropout Regulator — linear regulator with minimal input/output difference
MOSFETTransistor used as a switch or amplifier in power circuits
PWMPulse Width Modulation — technique used to regulate power converters
Power SequenceOrdered chain of rail enable events from G3H up to S0
VRMVoltage Regulator Module — converts input voltage to precise CPU/GPU supply